The AT-GDP Series SMD / BGA Rework Stations feature the latest vision and thermal process control technologies.
The AT-DB Flip Chip Die Bonders enable bonding via solder attach, thermal compression, and epoxy die attach processes.
PRO 1600 is a full forced air / nitrogen convection reflow oven with only a 31" x 31" footprint of floor space.
PRO 1600-RS is specifically configured for reflow simulation, package qualification, solderability and thermal stress testing applications.
The CAT90-SA pick and place systems are semi-automatic machines featuring software guidance and the latest high resolution vision technology.
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