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Reflow Simulation and Thermal Stress Test System for JEDEC MSL, Preconditioning, and Microvia Failure Detection

PRO 1600-RS Reflow Simulator & Thermal Stress Tester

PRO 1600-RS is designed for reflow simulation, package qualification, solderability and thermal stress testing applications. This includes Preconditioning of Nonhermetic Surface Mount Devices (SMD) per JESD22-A113 standard, Solderability test per J-STD-002 E (SMD Reflow), Moisture Sensitivity Level (MSL) testing of packages per IPC / JEDEC J-STD-020 E, MIL STD-202 Method 210 Condition I - Resistance to Soldering Heat testing, IPC 9631 standard, and thermal stress testings performed on bare PCBs or coupons.

PRO 1600-RST model is specifically configured for reflow simulation of PCB coupons per IPC-TM-650 2.6.27 Rev. A (Thermal Stress-Convection Reflow Assembly Simulation) with continuous resistance measurement during reflow cycles. Up to forty-eight (48) IPC-2221B Appendix A,D coupons may be processed per lot with resistance data read once per channel net every second. When subjected to 6 reflow cycles, each lot takes approximately 1 hour to complete and is performed automatically without any operator involvement between reflows. Lots may also be processed until net failure is detected. All temperature and resistance percent change data for each coupon is recorded and stored for documentation purposes. A Pass / Fail results summary provides a quick analysis of data for lot and individual coupon acceptance. Interchangeable carriers allow processing other IPC or custom coupons.

Instead of performing reflows in an inline tunnel oven which typically range 12 ft. - 20 ft. in length, the batch design of this reflow simulator enables processing is a compact footprint of only 31" x 31". All while maintaining profiling flexibility, control, and consistency of a production reflow oven. A unique feature to the PRO 1600-RS is the automatic profile repeat feature. It allows a profile to cycle automatically multiple times without any operator intervention. For SMD preconditioning and reflow simulation of surface mount parts, the standards require parts to be cycled 3X. For board coupon reflow, tests require 6X or more until failure is detected. Therefore, automating the process not only eliminates operator involvement in tracking and handling each pass, but also ensures consistency of each cycle and integrity of the test. Additional information and details of this feature are explained in papers titled Automating Preconditioning and Package Qualification Reflow Cycles and Automating Thermal Stress Reflow Simulation on PCB's

A proprietary design allows achieving temperature ramp up rates of up to 4° Celsius/second from ambient and programming of up to 10 profile zones. Warming up the oven prior to loading product and starting is not required as is the case with other smaller benchtop reflow systems. This ensures consistency since the product starts a reflow profile while at or near ambient temperatures for every cycle. On-the-fly settings adjustment capability allows creating and optimizing profiles all in a single pass. Precise software control delivers unsurpassed temperature uniformity. An optional Video Recording and Observation Module allows taking high magnification images and recording video during a soldering cycle.

Contact us and discover why some of the leading semiconductor and printed circuit fabrication companies prefer PRO 1600-RS reflow simulator for their preconditioning, package qualification, and thermal stress testing needs.

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  • Full Convection Reflow Simulator
  • Up to 10 individually programmable zones
  • Small Footprint of 31" x 31"
  • Computer control with comprehensive data logging and recording
  • Multiple Thermocouple Data Acquisition System
  • External Cooling Fans Module for rapid cooling of the product
  • No Warm-Up time required before operating
  • Integrated Exhaust Unit
  • Nitrogen compatible
  • External Thermocouple Control
  • Automatic Profile Repeat function (up to 10 times)
  • Plug and Operate Configuration
  • Designed and Manufactured in USA

Profiles are developed, stored, and recalled within PRO 1600’s software package. It controls the reflow cycle, automation of process sequences, and automatic execution of safety checks before and during every profile run.

  • Real-Time process graphing
  • Profile processing based on part / PCB temperature control*  
  • Profile development with up to 7 thermocouples
  • Library with predefined profiles
  • On-The-Fly settings adjustment
  • Real- time data recording for documentation and analysis
  • Password Protected Access
  • User friendly environment
  • Designed for Windows® 10 Pro OS
  • External Thermocouple Control (Part: ETC-PRO)
    • profile is executed based on temperature reading from the product
    • interchangeable between fixed and external thermocouple controls
  • Double Sided PCB Fixture (Part: DSBF-PRO)
  • Laptop Computer Stand (Part: LCS-PRO)
  • 400 VAC 3 Phase Electrical Configuration
  • Custom Fixtures / Trays and Cable Feed-Throughs
  • Video Recording and Observation Module (Part: VRM-PRO)
PRO 1600-RS
Temperature: up to 375° Celsius
Reflow Area: 20" x 20" / 508mm x 508mm
Topside Clearance: 4" / 101mm
Programmable Heating Zones: 10
Cooling Zones: 2
Heating Type: Full Forced Air / Nitrogen Convection
Interior: Stainless Steel
Air Requirements: 80 - 120 PSI @ 0.3 CFM
Power Requirements: 120/208 VAC, 3 Phase, 50 Amp, 50/60 Hz
Optional 125/250 VAC, 1 Phase, 50 Amp, 50/60 Hz
Optional 200-240 VAC, 3 Phase, 50 Amp, 50/60 Hz
Optional 380-400 VAC, 3 Phase, 50 Amp, 50/60 Hz
Peak Power Consumption: 16 Kw (during ramp up stages of a profile)
Operating Consumption: 9 Kw (during reflow)
Warranty: Five (5) years parts and labor
Agency Approvals: CE
Weight: 185 lbs / 84 Kg
Dimensions: 31"L x 31"W x 50"H / 787mm x 787mm x 1270mm
  • made-in-usa
  • years
  • ipc